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category
model
Current IT (A)(rxbhv)
Voltage (V)
Trigger current IG1
Trigger current IGT3
Trigger current IG4
Recommended chip
Trench opening method
Common packaging
Ohmic contact
Connection method
Filter criteria:
cleared condition

Model

Current IT (A)

Voltage (V)

Trigger current IG1

Trigger current IGT3

Trigger current IG4

Recommended chips

Trench opening method

Common Encapsulation

Ohmic contact

Connection method

BT139 or BTB16

16

800

5~20

Non-conductive

3.9*3.9

Single-sided groove

TO-220 or TO-263

Positive aluminum, negative silver

Aluminum wire bonding

BT138 or BTB12

12

800

5~20

Non-conductive

3.5*3.5

Single-sided slot

TO-220 or TO-263

Positive aluminum back silver

Aluminum wire bonding

BT137 or BTB08

8

600-800

5~20

Non-conductive

2.8*2.8

Single-sided slot

TO-220 or TO-252

Positive aluminum backing silver

Aluminum wire bonding

BT136 or BTB04

4

600-800

5~20

Non-conductive

2.1*2.1

Single-sided slot

TO-220 or TO-252

Positive aluminum backing silver

Aluminum wire bonding

BT134

2

600

1~10

Non-conductive

1.7*1.7

Single-sided slot

TO-126 with holes or TO-126P, SOT-223

Positive aluminum back silver

Aluminum wire bonding

97A8 or BT131

1

600

1~5

Non-conductive

1.26 * 1.26

Single-sided slot

TO-92, SOT-23-3L, SOT-89

Positive aluminum, negative silver

Aluminum wire bonding

97A6

0.8

600

1~5

Non-conductive

1.1*1.1

Single-sided groove

TO-92 SOT-23

Positive aluminum, negative silver

Aluminum wire bonding

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