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category
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Current IT (A)(rxbhv)
Voltage (V)
Trigger current IG1
Trigger current IGT3
Trigger current IG4
Recommended chip
Trench opening method
Common packaging
Ohmic contact
Connection method
Filter criteria:
cleared condition

Model

Current IT (A)

Voltage (V)

Trigger current IG1

Trigger current IGT3

Trigger current IG4

Recommended chips

Trench opening method

Common Encapsulation

Ohmic contact

Connection method

TYN1225

25

1200

5~20

4.3*4.3

Single-sided slot

TO-220

Positive aluminum back silver

Aluminum wire bonding

TYN625

25

600

5~20

4.3*4.3

Single-sided slot

TO-220

Positive aluminum backing silver

Aluminum wire bonding

BT153

16

800

10~20

3.3*3.3

Single-sided groove

TO-220

Positive aluminum, backed with silver

Aluminum wire bonding

BT152

12

600-800

10~20

2.9*2.9

Single-sided slot

TO-220 TO-252

Positive aluminum, negative silver

Aluminum wire bonding

BT151

8

600-800

5~15

2.5 multiplied by 2.5

Single-sided groove

TO-220 TO-252

Positive aluminum back silver

Aluminum wire bonding

X0405

4

600

1~10

1.7*1.7

Single-sided slot

TO-202, TO-251, TO-252

Positive aluminum back silver

Aluminum wire bonding

2P4M

2

600

1 to 10

1.5*1.5

Single-sided slot

TO-202, TO-251, TO-252

Pure aluminum backing silver

Aluminum wire bonding

MCR100-8, BT169

1

400-600

1-5

1.35 * 1.35

Single-sided groove

TO-92 SOT-23-3L SOT-89

Positive aluminum, negative silver

Aluminum wire bonding

MCR100-6

0.8

400-600

1-5

1.1*1.1

Single-sided groove

TO-92 SOT-23

Positive aluminum backing silver

Aluminum wire bonding

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